Thursday, March 03, 2022

Chip industry standardizes on UCIe chiplet ecosystem for interoperability

Good news!

"... Today, the industry consortium that includes AMD, Arm, Google Cloud, Intel, Meta, Qualcomm, Samsung and TSMC announced UCIe (Universal Chiplet Interconnect Express) as a new die-to-die interconnect to provide an open, multivendor chiplet ecosystem. More specifically, the ratified UCIe 1.0 specification covers the physical I/O layer, die-to-die protocols and a software stack that leverages the existing PCIe and CXL industry interconnect standards (although other protocols could also be used in principle). In addition, there is even support for inter-board interconnection: In the future, the industry expects to be able to connect different boards at the package level using co-packaged or even integrated photonics.  ..."

Chip industry standardizes on UCIe chiplet ecosystem for interoperability | VentureBeat

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