Good news!
"... Today, the industry consortium that includes AMD, Arm, Google Cloud, Intel, Meta, Qualcomm, Samsung and TSMC announced UCIe (Universal Chiplet Interconnect Express) as a new die-to-die interconnect to provide an open, multivendor chiplet ecosystem. More specifically, the ratified UCIe 1.0 specification covers the physical I/O layer, die-to-die protocols and a software stack that leverages the existing PCIe and CXL industry interconnect standards (although other protocols could also be used in principle). In addition, there is even support for inter-board interconnection: In the future, the industry expects to be able to connect different boards at the package level using co-packaged or even integrated photonics. ..."
No comments:
Post a Comment