China makes progress in 3-nm chips without advanced lithography tools

Amazing stuff!

"Chinese researchers have made early strides in pushing semiconductor processing nodes below 3-nm using older lithography technology, as more advanced extreme ultraviolet lithography (EUV) tools from ASML remain blocked under US sanctions. ..."

"... The Chinese Academy of Sciences (CAS) says its researchers have completed early integration of stacked nanosheet-channel GAA CMOS transistors using DUV tools. However, the technology remains at an early development stage and has not demonstrated that it can support commercial-scale production. ..."

China makes progress in 3-nm chips without advanced lithography tools | South China Morning Post (behind paywall)

China turns to older chipmaking technology to make, smaller, faster 3nm chips "The approach could give China another route toward advanced chipmaking despite restrictions on access to ASML’s EUV machines."

China crafts working 3nm gate-all-around transistors without EUV — stacked nanosheets target 3nm without EUV, but full node remains distant